Nghĩa của từ adhesive strength bằng Tiếng Việt

@Chuyên ngành kỹ thuật
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@Lĩnh vực: hóa học & vật liệu
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Đặt câu có từ "adhesive strength"

Dưới đây là những mẫu câu có chứa từ "adhesive strength", trong bộ từ điển Từ điển Anh - Việt. Chúng ta có thể tham khảo những mẫu câu này để đặt câu trong tình huống cần đặt câu với từ adhesive strength, hoặc tham khảo ngữ cảnh sử dụng từ adhesive strength trong bộ từ điển Từ điển Anh - Việt

1. Provided is a resin composition exhibiting high adhesive strength.

2. Provided is copper foil having low roughness and excellent adhesive strength.

3. with an adhesive strength of 1 764 mN/25 mm or more

4. Elastic one-component adhesive and sealant with fast development of adhesive strength.

5. — with an adhesive strength of 1 764 mN/25 mm or more,

6. Said compounds are also characterized by good adhesive strength and propagating ability.

7. with an adhesive strength of 1 764 mN / 25 mm or more

8. — with an adhesive strength of 1 764 mN / 25 mm or more

9. — with an adhesive strength of 1 764 mN/25 mm or more

10. The process gives smooth, glossy coatings with high adhesive strength, hardness and elasticity.

11. The binder has improved resistance to an electrolyte solution due to its enhanced adhesive strength.

12. [Effect] The adhesiveness (adhesive strength) of the nonslip member (1) comprising silicone resin is significantly improved.

13. This effect on the adhesive strength of greater differences in the dentin surface in the deep.

14. Novel Technical Variations and Increased Adhesive Strength in the "Birdlime" Transposition Technique for Microvascular Decompression.

15. The fastener preferably having reduced adhesive strength in the zones nearer the transverse sides of the flap.

16. However, the adhesive strength obtained was not so good as desired, or the adhesive tended to be deteriorated.

17. They must have a high adhesive strength and any attempt to remove them must result in their destruction

18. They must have a high adhesive strength and any attempt to remove them must result in their destruction.

19. The present invention aims to provide a means for improving the adhesive strength between a photoconductive layer and a substrate.

20. Application of the coarsest abrasive (80 grit) significantly improved wettability and shear (adhesive) strength in both dry and wet conditions.

21. This Creped paper tape fulfils all of the detailed needs for painting, such as heat resistance, adhesive strength, and material strength.

22. Additional influences on fracture behavior due to differences in matrix toughness and adhesive strength of the fiber/matrix interface are discussed.

23. It is well established that a biphasic relationship exists between the adhesive strength of b1 integrins and their ability to mediate cell movement.

24. Adheres to Skin Products for sticking to delicate surfaces such as skin, require firm adhesive strength, as well as gentleness to the skin.

25. To allow more efficient testing of these adhesives, a novel test method, the Stringer Bonding Test, has also been developed to assess adhesive strength.

26. Polyethylene and polyvinylchloride piles had an adhesive strength in the range 0.05–0.07 MPa; failure was characterized by separation between the pile and the ice.

27. An adhesive strength of 0.06 MPa was recorded in tension, and 0.13 MPa in compression, because of the relative stiffness of the pile and the ice.

28. The EMI shielding adhesive film according to the present invention has excellent adhesive strength to electronic components, heat resistance, electrical conductivity, flexibility, chemical resistance, and flame retardancy.

29. The exemplary resin mixture of the present application can provide a protection film for a polarizing plate, the protection film having excellent adhesive strength with a polarizer.

30. Said process leads to an enhanced adhesive strength, improved mechanical and thermal stress resistance as well as humidity resistance of multilayer printed circuit boards and IC substrates.

31. 19 It is obtained from test that the Rare - earth additives can improve the adhesive strength, decrease porosity, make porousness smaller, therefor, raise the properties of the arc spraying coatings.

32. In addition, sufficient adhesive strength can be maintained due to a large thickness even if a hollow lateral side is directly attached to the lower portion of an upper plate.

33. Additionally, the porous coating layer has a high adhesive strength to the porous base, thereby solving the problem that inorganic particles in the porous coating layer are separated in an assembly process for an electrochemical device.

34. Provided is a water-dispersing acrylic adhesive composition that can form a removable adhesive layer that has excellent resistance to an increase in adhesive strength, appearance traits, and low contamination properties with respect to an adherend.

35. An electrode of a solar cell, which is formed of the composition for an electrode of a solar cell, has excellent adhesive strength with a ribbon and a minimized serial resistance (Rs), thereby obtaining excellent conversion efficiency.

36. In addition, the present invention relates to a dicing film for semiconductors, which has filler to obtain solid physical properties and an excellent adhesive strength before being hardened, and a dicing die bonding film comprising the dicing film.

37. The liquid crystal alignment layer formed with the liquid crystal alignment layer composition of the present invention has excellent adhesive strength to the substrate and to an upper liquid crystal layer, and provides excellent homeotropic alignment to liquid crystals.

38. Provided are an adhesive composition suited for use as a hot melt adhesive that has low initial tack, and that after adhesion to an adherend, has ample adhesive strength through heat treatment; and an adhesive product employing the adhesive composition.

39. In particular, the EMI shielding adhesive film can be reliably applied to one or both sides of a FPCB where high flexibility, high adhesive strength, high heat resistance, and the like are required, and can effectively attenuate various kinds of electromagnetic waves generated in circuit boards.

40. The resin composition containing the polyolefin resin is used to prepare an encapsulant for various kinds of photoelectron devices, and thus can provide an encapsulant having excellent adhesive strength with a front substrate and a back sheet included in the devices, especially, improved long-term adhesive property and heat resistance.

41. Given that the wb-PSAs tend to have limited adhesive strength in general and limited ability to bond to certain substrates, the ‘Designed nanoscale heterogeneities for controlling water-borne pressure-sensitive adhesive performance’ (Nshape) project was developed to synthesise particles with nanoscale heterogeneities that enhance adhesion properties of wb-PSAs.

42. A coating film for a light shielding layer, formed of the photosensitive resin composition for light shielding, is characterized in that the coating film has excellent electrical characteristics, excellent adhesive strength with a substrate, and no deterioration in optical density, even after a high-temperature process at 300°C or higher.

43. Pigmented masonry primers for exterior uses shall score a pass in the EN 24624 (ISO 4624) pull-off test where the cohesive strength of the substrate is less than the adhesive strength of the paint, otherwise the adhesion of the paint must be in excess of a pass value of 1,5 MPa.

44. By manufacturing the hitch units with a synthetic resin which is the same material as used for the upper panel, it is possible to improve adhesive strength and airtightness when fixing the hitch units and the upper panel to each other, and to prevent distortion or separation of the hitch units due to different coefficients of thermal expansion.

45. Provided is a general reduced pressure type of dicing die-bonding film, wherein the tacky adhesive strength of a tacky-adhesive layer with respect to a ring frame and an adhesive layer is adjusted to an appropriate ratio, thereby obviating the need for additional processes such as ring-frame coating and avoiding the time and cost entailed in ultraviolet irradiation processing.

46. The present invention relates to a polyvinylalcohol based resin adhesive for a polarizing plate, having a pH value of 3.5 to 6.5 and retaining improved adhesive strength and water resistance, the adhesive containing a polyvinylalcohol based resin, a titanium lactate ammonium salt, hydroxy carboxylic acid, and water; to a polarizing plate including the same; and to an image display device.

47. The present invention relates to an adhesive composition and film for preparing a semiconductor, and more specifically, an adhesive composition for preparing a semiconductor which comprises an acrylic resin containing acrylonitrile, a mixture of an epoxy compound and a phenolic resin, and a filler, having excellent wafer pick-up characteristics during a semiconductor manufacturing process, and has excellent adhesive strength to a wafer, a lead frame and a PCB substrate, and an adhesive film for preparing a semiconductor, containing a coating layer of the composition.